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| INVITED MAM2024 |
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François Boulard (CEA-LETI, France)
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Cyclic etching processes for high selectivity and low plasma induced damage
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Silvia Braun (Fraunhofer ENAS, Germany)
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Electroplating of Aluminum using Ionic Liquids for Bonding, Via and RDL applications
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Ivan Ciofi (IMEC, Belgium)
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Alternative Metallization: Benefits and Concerns
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Andre Clausner (Fraunhofer IKTS Dresden, Germany)
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Advanced Characterisation and Modelling for Degradation Processes in Copper BEoL Stacks of next-generation Power Devices
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Mariane Coig (CEA-leti, France)
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Si and Mg ion implantation for doping of GaN grown on silicon
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Simon Elliott (Schrödinger , Ireland)
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Simulating conditions for the atomic level processing of metals
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Paolo Fantini (Micron technology, Italy)
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Memory Technology enabling the future computing systems
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Patrice Gergaud (CEA-LETI, France)
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Strain and lattice tilt mapping of GaN on Si nanowires at early stage of coalescence by synchrotron x-ray nano diffraction
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Fiqiri Hodaj (SIMaP, Grenoble, France)
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Fundamental issues of wetting and interfacial reactivity in electronic packaging
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Delphine Le Cunff (STMicroelectronics, France)
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Overview of Inline Metrology Challenges in IC manufacturing environment
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Frédéric Leroy (CINaM, France)
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Low energy electron microscopy: from basic principles to surface dynamics of semiconductors
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Giulio Marti (IMEC, Belgium)
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Direct Metal Etch and Semi-Damascene Integration of Ruthenium: A Game-changer for interconnects
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Simon Ruel (CEA-LETI, France)
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Low damage Etching processes developments for GaN-based devices patterning
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Sabina Spiga (CNR-IMM, Italy)
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Resistive switching memories for spiking neural networks
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Andre Vantomme (Katholieke Universiteit Leuven, Belgium)
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Controlling Ni silicide formation by ion implantation
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Bettina Wehring (Fraunhofer IPMS, Germany)
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Material screening for future diffusion barriers: modelling of binary and ternary metal alloys and detailed experimental analysis of their barrier performance
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